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Kompak slot dies for high outputs/h
HIP-MITSU “Kompak” slot dies for hot melt adhesives are designed and realized for productions requiring very high adhesive’s flow rates per hour.
Usable with hot melt adhesives, reactive PUR and UV curable too.
They are complete with both manifold and high precision pumping station. They turn out to be particularly suitable to polymers/adhesives already being at their melting state, as they are produced e.g. on extrusion lines.
Manifold can be either integrated or separated, depending on space available in the line.
Easy to install: HIP-MITSU “Kompak” slot dies are all equipped with customized and self-supporting mechanical stand, enabling easy and quick installation both on existing and new lines.
Electrical and electronic integration is based on an “open source” platform, enabling a very simple and quick interface to the main line.
Coating width: from 100 up to 6.000 mm
Adhesive viscosity: from 100 up to 120.000 mpas
Working temperature: from 30 up to 240°C
Line speed: from 2 up to 900 m/min
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